GRATIS VERZENDING - GEEN MINIMALE AFNAME - VEILIG BETALEN - RUIME KEUZE - SCHERPE PRIJZEN

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Beschrijving

Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems, to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

Medewerkers

Uitgever Frederic P. Miller

Uitgever Agnes F. Vandome

Uitgever John McBrewster

Productdetails

DUIN 36S8A1KK68Q

GTIN 9786131703386

Taal Engels

Pagina-aantallen 80

Product type Paperback

Maat 220  mm

Flip chip

Frederic P. Miller

€ 30,38

Verkoper Dodax EU

Bezorgdatum: tussen dinsdag, 10. november en donderdag, 12. november

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