High Frequency Interconnect Characterization and Modeling - For VLSI On-Chip Interconnects and RF Package Wire Bonds

door Qi, Xiaoning
Staat: Nieuw
€ 56,06
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Qi, Xiaoning High Frequency Interconnect Characterization and Modeling - For VLSI On-Chip Interconnects and RF Package Wire Bonds
Qi, Xiaoning - High Frequency Interconnect Characterization and Modeling - For VLSI On-Chip Interconnects and RF Package Wire Bonds

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Levering: tussen 2021-05-25 en 2021-05-27
Verkoop en verzending: Dodax EU

Omschrijving

Continuous scaling of transistors combined with
increased chip area results in the ratio of global
wire delay to gate delay increasing at a super-linear
rate. Simple RC models have become inadequate for
simulation of VLSI circuits. In addition, parasitic
inductance and capacitance of IC packages impose
limits on the circuit performance at RF frequencies.
This book presents modeling of on-chip inductance for
chips with ground grids that emulate those used in
real circuits. S-parameter characterization of test
chips up to 10 GHz shows good agreement with
simulation and analytical calculations. On-chip 3-D
capacitance modeling capabilities for arbitrarily
shaped objects are also presented. In addition, an
approach to fast 3-D modeling of the geometry for
bonding wires in RF circuits and packages is
demonstrated. The geometry and an equivalent circuit
are presented to model the frequency response of
bonding wires. Excellent agreement between modeled
results and measured data is achieved for frequencies
up to 10 GHz. The book should be useful to the
semiconductor professionals in academia and industry,
who are interested in the on-chip and package
interconnects researches.

Bijdragers

Schrijver:
Qi, Xiaoning

Productdetails

Biografie:
Xiaoning Qi, Ph.D.: Studied Electrical Engineering at Stanford
University. Senior Staff Engineer at Intel Corp. on signal and
power integrity for semiconductor systems. He worked on power
integrity for high speed I/O, process variation, leakage
currents, on-chip interconnects and CAD tools at Rambus, Synopsys
and Sun Microsystems, California.
Taal:
Englisch
Aantal pagina’s:
132
Mediatype:
Taschenbuch
Uitgever van videogames:
VDM Verlag Dr. Müller

Basisgegevens

Product Type:
Paperback book
Afmetingen pakket:
0.22 x 0.15 x 0.008 m; 0.245 kg
GTIN:
09783639130959
DUIN:
GUIINJNMVOC
€ 56,06
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